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 AS1329
L o w Vo l ta g e , M i c r o p o w e r, D C - D C St e p - U p C o n v e r t e r s
D a ta S he e t
1 General Description
The AS1329A, AS1329B and the AS1329C are synchronous, fixed frequency, very high-efficiency DC-DC boost converters capable of supplying 3.3V at 160mA from a single AA-supply. Compact size and minimum external parts requirements make these devices perfect for modern portable devices. High-speed switching frequency (1.2MHz) and internally compensated PWM current mode design provide highlyreliable DC-DC conversion, especially when driving white LEDs. The converters are available as the standard products listed in Table 1. Table 1. Standard Products Model AS1329A Light Load Switching Medium Load Automatic Powersave Operation
2 Key Features
! ! ! ! ! ! ! ! ! ! ! ! !
95% Efficiency Single-Cell Operation Delivers 160mA @ 3.3V (from Single AA Cell) Delivers 220mA @ 5.0V (from Two AA Cells) Delivers 570mA @ 3.3V (from Two AA Cells) Low Start-Up Voltage: 0.85V High-Speed Fixed-Frequency: 1.2MHz Internal PMOS Synchronous Rectifier Automatic Powersave Operation (AS1329A&B) Continuous Switching at Light Loads (AS1329C) Anti-Ringing Control Minimizes EMI Logic Controlled Shutdown (< 1A) Output Range: 2.5 to 5.0V 6-pin TSOT-23 Package
AS1329B Light Load Automatic Powersave Operation AS1329C Continuous Switching
The devices contain two internal MOSFET switches: one NMOS switch and one PMOS synchronous rectifier. Anti-ringing control circuitry reduces EMI by damping the inductor in discontinuous mode, and the devices exhibit extremely low quiescent current (< 1A) in shutdown. In shutdown mode the battery is connected directly to the output enabling the supply of real-time-clocks. The AS1329 is available in a 6-pin TSOT-23 package.
!
3 Applications
The AS1329 is ideal for low-power applications where ultra-small size is critical as in medical diagnostic equipment, hand-held instruments, pagers, digital cameras, remote wireless transmitters, MP3 players, LCD bias supplies, cordless phones, GPS receivers, and PC cards.
Figure 1. Typical Application Diagram - Single Cell to 3.3V Synchronous Boost Converter
L1 4.7H
1 AA Battery C1 10F
6
SW
5 VOUT
VIN
AS1329
4 3
R1 1.02M 1% FB
C2 10F
VOUT 3.3V 160mA
On Off
SHDNN 2 GND
R2 604k 1%
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AS1329 Data Sheet
- Pin Assignments
4 Pin Assignments
Figure 2. Pin Assignments (Top View)
SW 1
6 VIN
GND 2
AS1329
5 VOUT
FB 3
4 SHDNN
Pin Descriptions
Table 2. Pin Descriptions Pin Name Pin Number Description Switch Pin. Connect an inductor between this pin and VIN. Keep the PCB trace lengths as short and wide as is practical to reduce EMI and voltage overshoot. If the inductor current falls to zero, or pin SHDNN is low, an internal 100 anti-ringing switch is connected from this pin to VIN to minimize EMI. Note: An optional Schottky diode can be connected between this pin and VOUT. Signal and Power Ground. Provide a short, direct PCB path between this pin and the negative side of the output capacitor(s). Feedback Pin. Feedback input to the gm error amplifier. Connect a resistor divider tap to this pin. The output voltage can be adjusted from 2.5 to 5V by: VOUT = 1.23V[1 + (R1/R2)] Shutdown Pin. Logic controlled shutdown input. 1 = Normal operation, 1.2MHz typical operating frequency. 0 = Shutdown; quiescent current <1A. If SHDNN is undefined, pin SW may ring. Note: In a typical application, SHDNN should be connected to VIN through a 1M pull-up resistor. Output Voltage Sense Input and Drain of the Internal PMOS Synchronous Rectifier. Bias is derived from VOUT when VOUT exceeds VIN. PCB trace length from VOUT to the output filter capacitor(s) should be as short and wide as is practical. Input Voltage. The AS1329 gets its start-up bias from VIN unless VOUT exceeds VIN, in which case the bias is derived from VOUT. Thus, once started, operation is completely independent from VIN. Operation is only limited by the output power level and the internal series resistance of the supply.
SW
1
GND FB
2 3
SHDNN
4
VOUT
5
VIN
6
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AS1329 Data Sheet
- Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 3. Absolute Maximum Ratings Parameter VIN to GND SHDNN, SW to GND FB to GND VOUT Operating Temperature Range Storage Temperature Range Min -0.3 -0.3 -0.3 -0.3 -40 -65 Max 7 7 5 7 +85 +125 Units V V V V C C The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD020C "Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices". The lead finish for Pb-free leaded packages is matte tin (100% Sn). Notes
Package Body Temperature
+260
C
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AS1329 Data Sheet
- Electrical Characteristics
6 Electrical Characteristics
TAMB = -40 to +85C, VIN = +1.2V, VOUT = +3.3, VSHDNN = +1.2V (unless otherwise specified). Typ values @ TAMB = +25C. Table 4. Electrical Characteristics Symbol Parameter Minimum Start-Up Voltage Minimum Operating Voltage Output Voltage Adjust Range VFB IFB IQPWS IQSHDNN IQ INMOSSWL IPMOSSWL RONNMOS Feedback Voltage Feedback Input Current Quiescent Current (Powersave Operation) Quiescent Current (Shutdown) Quiescent Current (Active) NMOS Switch Leakage PMOS Switch Leakage NMOS Switch On Resistance Conditions ILOAD = 1mA SHDNN = VIN TAMB = 25C TAMB = TMIN to TMAX VFB = 1.25V
3 2 1
Min
Typ 0.85 0.65
Max 1 0.85 5
Units V V V V nA
2.5 1.192 1.23 1 30 0.01 150 0.1 0.1 0.35 0.20 0.45 0.30 850
2
1.268
VFB = 1.4V , AS1329A&B only VSHDNN = 0V VFB = 1.4V , AS1329B only VSW = 5V VSW = 0V VOUT = 3.3V VOUT = 5V VOUT = 3.3V VOUT = 5V VIN = 2.5V AS1329A only
3
50 1 300 5 5 0.8 0.7 0.8 0.7
A A A A A mA mA %
RONPMOS INMOS IPS
PMOS Switch On Resistance NMOS Current Limit Powersave Operation Current Threshold Max Duty Cycle
3 80 0.95 0.85 1 0.35 87 1.2 1.2 1.5 1.5
VFB = 1V, TAMB = TMIN to TMAX TAMB = 25C TAMB = TMIN to TMAX
fSW VSHDNNH VSHDNNL ISHDNN
Switching Frequency SHDNN Input High SHDNN Input Low SHDNN Input Current
MHz V V A
VSHDNN = 5.0V
0.01
1
1. Minimum VIN operation after start-up is only limited by the battery's ability to provide the necessary power as it enters a deeply discharged state. 2. Specification is guaranteed by design and not 100% production tested. 3. IQPWS is measured at VOUT. Multiply this value by VOUT/VIN to get the equivalent input (battery) current.
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AS1329 Data Sheet
- Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
7 Typical Operating Characteristics
Figure 3. Powersave mode threshold vs. VIN, VOUT = 3.0V
30 25
Figure 4. Efficiency vs. Output Current, VOUT = 3.3V
100 90
VIN = 2.4V VIN = 1.5V
Output Current (mA)
.
20 15 10 5 0 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5
Efficiency (%) .
80 70
VIN = 1.0V
60 50 40 30 1 10 100 1000
Battery Voltage (V)
Output Current (mA)
Figure 5. Output Voltage vs. Temperature; VOUT = 3.3V, IOUT = 10mA
3.36 3.34
Figure 6. Output Voltage vs. Battery Voltage; VOUT = 3.3V, IOUT = 10mA
3.5 3
Output Voltage (V) .
Output Voltage (V) .
-25 0 25 50 75 100
3.32 3.3 3.28 3.26 3.24 -50
2.5 2 1.5 1 0.5 0 0 0.5 1 1.5 2 2.5 3 3.5
Temperature (C)
Battery Voltage (V)
Figure 7. Startup Voltage vs. Output Current;
1.6 1.5
Figure 8. Output Current vs. Battery Voltage; VOUT = 3.3V, 3% Tolerance
1000 900
Startup Voltage (V) .
1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 0.1 1 10 100
5V 3.3V
. Output Current (mA)
800 700 600 500 400 300 200 100 0 0.5 1 1.5 2 2.5 3
Output Current (mA)
Battery Voltage (V)
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AS1329 Data Sheet
- Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
Figure 9. Output Current vs. Battery Voltage; VOUT = 5.0V, 3% Tolerance
900 800
Figure 10. No Load Battery Current vs. VBATT VOUT = 3.3V, TAMB = 25C
1000
.
700
600 500 400 300 200 100 0 0.5 1 1.5 2 2.5 3 3.5 4
Battery Current (A) .
Output Current (mA)
100
10 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
Battery Voltage (V)
Battery Voltage (V)
Figure 11. SW Pin Antiringing Operation VIN = 1.3V, VOUT = 3.3V, L = 10H, C = 10F, IOUT = 5mA
Figure 12. SW Pin Fixed Frequency Continuous Current VIN = 1.3V, VOUT = 3.3V, L = 10H, C = 10F, IOUT = 100mA
1V/Div
VSW
0V
VSW
100ns/Div
100ns/Div
Figure 13. VOUT Transient Response. VIN = 1.3V, VOUT = 3.3V, L = 10H, C = 10F
Figure 14. Fixed Frequency vs. Powersave Operation VIN = 1.3V, VOUT = 3.3V, L = 10H, C = 10F
100mV/Div
100mA
100s/Div
40mA
10ms/Div
Parts used for measurments: 10H (MOS6020-103ML) Inductor, 10F (GRM31CR70J106KA01L) CIN and COUT
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1mA
IOUT
IOUT
60mA 100mV/Div
VOUT(AC)
VOUT(AC)
0V
1V/Div
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AS1329 Data Sheet
- Detailed Description
8 Detailed Description
The AS1329 can operate from a single-cell input voltage (VIN) below 1V, and features fixed frequency (1.2MHz) and current mode PWM control for exceptional line- and load-regulation. With low RDS(ON) and gate charge internal NMOS and PMOS switches, the device maintains high-efficiency from light to heavy loads. Modern portable devices frequently spend extended time in low-power or standby modes, switching to high powerdrain only when certain functions are enabled. The AS1329A, AS1329B and AS1329C are ideal for portable devices since they maintain high-power conversion efficiency over a wide output power range, thus increasing battery life in these types of devices. In addition to high-efficiency at moderate and heavy loads, the AS1329A as well as the AS1329B includes an automatic powersave mode that improves efficiency of the power converter at light loads. The powersave mode is initiated if the output load current falls below a factory programmed threshold (see Figure 3 on page 5). Note: The AS1329C does not support powersave mode and provides continuous operation at all loads, eliminating low-frequency VOUT ripple at the expense of light load efficiency. Figure 15. Block Diagram
L1 4.7H 1.5V Single Cell
6 Start Up OSC
1
SW
- VOUT Good + 2.3V 5 VOUT 3.3V Output
VIN CIN 1F
A B
A/B MUX
PWM Control Sync Drive Control 1.2MHz Ramp Generator + PWM - Comp - Slope Compensator
0.35 Current Sense
0.45 CFF* R1 1.02M 1% COUT 4.7F
AS1329
- gm Error Amp + 3
FB
4
SHDNN
Shutdown Control
Shutdown
Powersave Operation Control
RC 80k CC 150pF
CP2 2.5pF
1.23V Ref
Powersave
R2 640k 1%
2 * Optional
GND
Low-Voltage Start-Up
The AS1329 requires VIN of only 0.85V (typ) or higher to start up. The low-voltage start-up circuitry controls the internal NMOS switch up to a maximum peak inductor current of 850mA (typ), with 1.5ms (approx.) off-time during start-up, allowing the devices to start up into an output load. With a VOUT > 2.3V, the start-up circuitry is disabled and normal fixed-frequency PWM operation is initiated. In this mode, the AS1329 operates independent of VIN, allowing extended operating time as the battery can drop to several tenths of a volt without affecting output regulation. The limiting factor for the application is the ability of the battery to supply sufficient energy to the output.
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AS1329 Data Sheet
- Detailed Description
Low-Noise Fixed-Frequency Operation
Oscillator
The AS1329 switching frequency is internally fixed at 1.2MHz allowing the use of very small external components.
Error Amplifier
The integrated error amplifier is an internally compensated trans-conductance (gm) type (current output). The internal 1.23V reference voltage is compared to the voltage at pin FB to generate an error signal at the output of the error amplifier. A voltage divider from VOUT to GND programs the output voltage from 2.5 to 5V via pin FB as: VOUT = 1.23V(1 + (R1/R2)) (EQ 1)
Current Sensing
A signal representing the internal NMOS-switch current is summed with the slope compensator. The summed signal is compared to the error amplifier output to provide a peak current control command for the PWM. Peak switch current is limited to approximately 850mA independent of VIN or VOUT.
Zero Current Comparator
The zero current comparator monitors the inductor current to the output and shuts off the PMOS synchronous rectifier once this current drops to 20mA (approx.). This prevents the inductor current from reversing polarity and results in improved converter efficiency at light loads.
Anti-Ringing Control
Anti-ringing control circuitry prevents high-frequency ringing on pin SW as the inductor current approaches zero. This is accomplished by damping the resonant circuit formed by the inductor and the capacitance on pin SW (CSW).
Powersave Operation (AS1329A, AS1329B)
In light load conditions, the integrated powersave feature removes power from all circuitry not required to monitor VOUT. When VOUT has dropped approximately 1% from nominal, the AS1329A & B powers up and begins normal PWM operation. COUT (see Figure 15 on page 7) recharges, causing the AS1329A and AS1329B to re-enter powersave mode as long as the output load remains below the powersave threshold. The frequency of this intermittent PWM is proportional to load current; i.e., as the load current drops further below the powersave threshold, the AS1329A and AS1329B turns on less frequently. When the load current increases above the powersave threshold, the AS1329A and AS1329B will resume continuous, seamless PWM operation. While the AS1329A switches to automatic powersave mode already at medium loads, the AS1329B will do so only at very light loads. Notes: 1. An optional capacitor (CFF) between pins VOUT and FB in some applications can reduce VOUTp-p ripple and input quiescent current during powersave mode. Typical values for CFF range from 15 to 220pF. 2. In powersave mode the AS1329A and AS1329B draws only 30A from the output capacitor(s), greatly improving converter efficiency.
Shutdown
When pin SHDNN is low the AS1329 is switched off and <1A current is drawn from battery; when pin SHDNN is high the device is switched on. If SHDNN is driven from a logic-level output, the logic high-level (on) should be referenced to VOUT to avoid intermittently switching the device on. Note: If pin SHDNN is not used, it should be connected directly to pin OUT. In shutdown the battery input is connected to the output through the inductor and the internal synchronous rectifier PFET. This allows the input battery to provide backup power for devices such as an idle microcontroller, memory, or realtime-clock, without the usual diode forward drop. In this way a separate backup battery is not needed. In cases where there is residual voltage during shutdown, some small amount of energy will be transferred from pin OUT to pin BATT immediately after shutdown, resulting in a momentary spike of the voltage at pin BATT. The ratio of CIN and COUT partly determine the size and duration of this spike, as does the current-sink ability of the input device. www.austriamicrosystems.com Revision 1.01 8 - 17
AS1329 Data Sheet
- Application Information
9 Application Information
The AS1329 is perfectly suited for LED matrix displays, bar-graph displays, instrument-panel meters, dot matrix displays, set-top boxes, white goods, professional audio equipment, medical equipment, industrial controllers to name a few applications. Along with Figure 1 on page 1, Figures 16-19 depict a few of the many applications for which the AS1329 converters are perfectly suited. Figure 16. Single AA Cell to 3.3V Synchronous Boost Converter with Load Disconnect in Shutdown
L1 4.7H 1 SW
6 5 VOUT
D1
AA Battery
C1 4.7F
VIN
VOUT 3.3V, 160mA R3 510k R1 1.02M 1%
AS1329
4
C2 4.7F
On Off
3
SHDNN 2 GND
FB
R2 604k 1% Q1
R3 510k
Figure 17. Single Lithium Cell to 5V, 250mA
Optional Snubber
2 100nF L1 4.7H 1 SW
6 5 VOUT
D1
Lithium Battery
VIN C1 4.7F
AS1329
4
C2 4.7F
R1 1.02M 1%
C3 100pF
On Off
3
SHDNN 2 GND
FB R2 332k 1%
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AS1329 Data Sheet
- Application Information
Figure 18. Single AA Cell to 3V Synchronous Boost Converter
L1 4.7H 1 SW
6 5 VOUT
C3 1F
AA Battery
VIN C1 4.7F
VOUT1 3V, 90mA R1 1.02M 1% C2 4.7F
AS1329
4 3
On Off
SHDNN 2 GND
FB R2 750k 1%
D1
D2 C4 10F VOUT2 -3V, 10mA
Figure 19. Single AA Cell to 2.5V Synchronous Boost Converter
L1 4.7H 1
6
D1
SW
5 VOUT
AA Battery
VIN C1 10F
VOUT 2.5V, 230mA R1 1.02M 1% C2 10F
AS1329
4 3
On Off
SHDNN 2 GND
FB R2 1.02M 1%
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AS1329 Data Sheet
- Application Information
External Component Selection
Inductor Selection
The fast switching frequency (1.2MHz) of the AS1329 allows for the use of small surface mount or chip inductor for the external inductor (see Figure 15 on page 7). The required minimum values for the external inductor are:
! !
3.3H for applications 3.6V 4.7H for applications > 3.6V
Larger inductor values allow greater output current capability by reducing the inductor ripple current. Increasing the inductance above 10H will increase size while providing negligible improvement in output current capability. The approximate output current capability of the AS1329 versus inductor value is given in: VIN D IOUT ( MAX ) = IP - ----------------- ( 1 - D ) f L 2 Where: is the estimated efficiency; IP is the peak current limit value (0.6A); VIN is the input voltage; D is the steady-state duty ratio = (VOUT - VIN)/VOUT; f is the switching frequency (1.2MHz typ); L is the inductor value. The inductor current ripple is typically set for 20 to 40% of the maximum inductor current (IP). High-frequency ferrite core inductor materials reduce frequency dependent power losses compared to less expensive powdered iron types, which result in improved converter efficiency. The inductor should have low ESR to reduce the I R power losses, and must be able to handle the peak inductor current without saturating. Molded chokes and some chip inductors normally do not have enough core to support the peak inductor currents of the AS1329 (850mA typ). To minimize radiated noise, use a toroid, pot core, or shielded bobbin inductor. Table 5. Recommended Inductors Part Number MOS6020-103ML MOS6020-472ML MOS6020-332ML CDRH4D18-100 CDRH4D18-6R8 CR43-6R8 CDRH4D18-4R7 L 10H 4.7H 3.3H 10H 6.8H 6.8H 4.7H DCR 93m 50m 46m 200m 200m 131.2m 162m Current Rating Dimensions (L/W/T) 1A 1.5A 1.8A 0.61A 0.76A 0.95A 0.84A 6.8x6.0x2.4mm 6.8x6.0x2.4mm 6.8x6.0x2.4mm 6.9x5.0x2.0mm 6.9x5.0x2.0mm 4.8x4.3x3.5mm 6.9x5.0x2.0mm Sumida www.sumida.com Manufacturer Coilcraft www.coilcraft.com
2
(EQ 2)
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AS1329 Data Sheet
- Application Information
Figure 20. Efficiency Comparison of Different Inductors, VIN = 1.5V, VOUT = 3.3V
90 85 80 75
92 90 88
Efficiency (%)
Efficiency (%)
70 65 60 55 50 45 40 0.1 1 10
10uH - Coi l cr af t (M OS6020-103M L) 10uH - Sumi da(CDRH4D18-100) 6. 8uH - Sumi da(CDRH4D18-6R8) 6. 8uH - Sumi da(CR43-6R8) 4. 7uH - Coi l cr af t (M OS6020-472M L) 4. 7 uH - Sumi da(CDRH4D18-4R7) 3. 3 uH - Coi l cr af t (M OS6020-332M L)
86 84 82
10uH - Coi l cr af t (M OS6020-103M L)
80 78 76
10uH - Sumi da(CDRH4D18-100) 6. 8uH - Sumi da(CDRH4D18-6R8) 6. 8uH - Sumi da(CR43-6R8) 4. 7uH - Coi l c r af t (M OS6020-472M L) 4. 7 uH - Sumi da(CDRH4D18-4R7) 3. 3 uH - Coi l c r af t (M OS6020-332M L) S i 8
Output Current (mA)
10
Output Current (mA)
100
Output Capacitor Selection
Low ESR capacitors should be used to minimize VOUT ripple. Multi-layer ceramic capacitors are recommended since they have extremely low ESR and are available in small footprints. A 2.2 to 10F output capacitor is sufficient for most applications. Larger values up to 22F may be used to obtain extremely low output voltage ripple and improve transient response. An additional phase lead capacitor may be required with output capacitors larger than 10F to maintain acceptable phase margin. X5R and X7R dielectric materials are recommended due to their ability to maintain capacitance over wide voltage and temperature ranges. Table 6. Recommended Output Capacitor Part Number JMK212BJ226MG-T Input Capacitor Selection Low ESR input capacitors reduce input switching noise and reduce the peak current drawn from the battery. Ceramic capacitors are recommended for input decoupling and should be located as close to the device as is practical. A 4.7F input capacitor is sufficient for most applications. Larger values may be used without limitations. Table 7. Recommended Input Capacitor Part Number C TC Code Rated Voltage Dimensions (L/W/T) X7R 6.3V 3.2x1.6x1.6mm Manufacturer Murata www.murata.com C 22F 20% TC Code Rated Voltage X5R 6.3V Dimensions (L/W/T) 2x1.3x1.3mm Manufacturer Taiyo Yuden www.t-yuden.com
GRM31CR70J106KA01L 10F 10% Diode Selection
A Schottky diode should be used to carry the output current for the time it takes the PMOS synchronous rectifier to switch on. For VOUT < 4.5V a Schottky diode is optional, although using one will increase device efficiency by 2 to 3%. Note: Do not use ordinary rectifier diodes, since the slow recovery times will compromise efficiency.
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AS1329 Data Sheet
- Application Information
PCB Layout Guidelines
The high-speed operation of the AS1329 requires proper layout for optimum performance. Figure 21 shows the recommended component layout.
! ! ! ! !
A large ground pin copper area will help to lower the device temperature. A multi-layer board with a separate ground plane is recommended. Traces carrying large currents should be direct. Trace area at pin FB should be as small as is practical. The lead-length to the battery should be as short as is practical.
Figure 21. Recommended Single-Layer Component Placement
Optional
1 SW VIN 6 AS1329
VIN CIN R2
2 GND
VOUT 5 SHDNN
3
FB SHDNN
4
R1
COUT VOUT
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AS1329 Data Sheet
- Package Drawings and Markings
10 Package Drawings and Markings
The device is available in a 6-pin TSOT-23 package. Figure 22. 6-pin TSOT-23 Package
3 4 A
A
3
4
6
7
Notes: 1. Dimensioning and tolerancing conform to ASME Y14.5M - 1994. 2. Dimensions are in millimeters. 3. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall not exceed 0.15mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15mm per side. Dimensions D and E1 are determined at datum H. 4. The package top can be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but include any mistmatches between the top of the package body and the bottom. D and E1 are determined at datum H. 5. Datums A and B are to be determined at datum H.
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AS1329 Data Sheet
- Package Drawings and Markings
6. These dimensions apply to the flat section of the lead between 0.08 and 0.15mm from the lead tip. 7. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the b dimension at the maximum material condition. The dambar cannot be located on the lower radius of the foot. Minimum space between the protrusion and an adjacent lead shall not be less than 0.77mm. Symbol A A1 A2 b b1 c c1 D E E1 e e1 L L1 L2 N R R1 Min 0.01 0.84 0.30 0.31 0.12 0.08 Typ 0.05 0.87 0.35 0.15 0.13 2.90BSC 2.80BSC 1.60BSC 0.95BSC 1.90BSC 0.40 0.60REF 0.25BSC 6 Max 1.00 0.10 0.90 0.45 0.39 0.20 0.16 Notes
6,7 6,7 6 6 3,4 3,4 3,4
0.30
0.50
0.10 0.10 0 4
0.25 8
1
aaa bbb ccc ddd
4 10 12 Tolerances of Form and Position 0.15 0.25 0.10 0.20
1,2 1,2 1,2 1,2
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AS1329 Data Sheet
- Ordering Information
11 Ordering Information
The device is available as the standard products listed in Table 8. Table 8. Ordering Information Model AS1329A-BTTT Marking ASPA Descriptiom Low Voltage, Micropower, DC-DC Step-Up Converter with Automatic Powersave Operation beginning at Medium Loads Low Voltage, Micropower, DC-DC Step-Up Converter with Automatic Powersave Operation beginning at Light Loads Low Voltage, Micropower, DC-DC Step-Up Converter with Continuous Switching Delivery Form Tape and Reel Package 6-pin TSOT-23
AS1329B-BTTT AS1329C-BTTT
ASPB ASPC
Tape and Reel Tape and Reel
6-pin TSOT-23 6-pin TSOT-23
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AS1329 Data Sheet
Copyrights
Copyright (c) 1997-2007, austriamicrosystems AG, Schloss Premstaetten, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered (R). All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. All products and companies mentioned are trademarks or registered trademarks of their respective companies.
Disclaimer
Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or lifesustaining equipment are specifically not recommended without additional processing by austriamicrosystems AG for each application. For shipments of less than 100 parts the manufacturing flow might show deviations from the standard production flow, such as test flow or test location. The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However, austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of austriamicrosystems AG rendering of technical or other services.
Contact Information
Headquarters austriamicrosystems AG A-8141 Schloss Premstaetten, Austria Tel: +43 (0) 3136 500 0 Fax: +43 (0) 3136 525 01
For Sales Offices, Distributors and Representatives, please visit: http://www.austriamicrosystems.com/contact
www.austriamicrosystems.com
Revision 1.01
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